This laboratory etching system is available with various combinations of features, such as atmospheric cassettes, single wafer atmospheric transfer, and vacuum transfer. With touch panel operation, it is possible to automatically control substrate transfer, evacuation, and etching. Small footprint thanks to integration of mechanical and electrial components.


  • Five-tier atmospheric cassette module provided as standard allows the automatic processing of multiple pre-set trays
  • Recipes to be processed can be entered through touch panel operation
  • CCP (Capacitively Coupled Plasma); R-type provided as standard; ICP; I-type available as an option


  • Reserch & development


System configuration atmospheric cassettes + atmospheric transfer + etching chamber
Transfer mechanism Pneumatic manipulator (atmospheric transfer)
Applicable substrate thickness φ150mm x 1
Plasma method CCP (ICP is option)