This system enable deep Si etching using ULVAC original process, doesn't use Bosch process nor Cyro Genics process. This system is also available for quartz etching.


  • Good repeatability and stable process.
  • High selectivity to Photo Resist (200 - 500), good control for CD shift.
  • Smooth side wall after etching.
  • Can do etching of ultra fine devices (<100nm) and high aspect ratio devices.
  • Can do deep etching of glass substrate (quartz, Pyrex).


  • Electric industry
  • Optical industry
  • Metal, Machinery industry
  • R&D
  • Bio